The integration of conventional terrestrial wireless communication networks and non-terrestrial networks (NTNs) is the main prerequisite for achieving global connectivity in the next generation (6G) wireless communications. Such integrated communication networks are usually referred to as the unified 3D networks. These networks need to meet the requirements for 6G communications in terms of higher data rates, as well as enhanced reliability, security and network reconfigurability. To achieve these goals, new technologies and components have to be developed. This work introduces the German project 6G-TakeOff, aimed at the development of innovative solutions for unified 3D networks. The project consortium brings together leading academic and industrial partners, covering the entire value chain from design of electronics to applications. In this work, the focus is on the development of key hardware components to support the wireless communication in 3D unified networks. The design concept for each component and the planned demonstrators are presented.